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| CATALOG |
FAN6862TY COUNTRY OF ORIGIN
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FAN6862TY PARAMETRIC INFO
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FAN6862TY PACKAGE INFO
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FAN6862TY MANUFACTURING INFO
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FAN6862TY PACKAGING INFO
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COUNTRY OF ORIGIN
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| United States of America |
| Taiwan (Province of China) |
| Philippines |
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PARAMETRIC INFO
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| Topology |
Flyback |
| Soft Start Option |
Yes |
| Maximum Switching Frequency (kHz) |
68 |
| Minimum Under Voltage Lock Out (V) |
7.5 |
| Typical Under Voltage Lock Out (V) |
8.5 |
| Maximum Under Voltage Lock Out (V) |
9.5 |
| Maximum Supply Voltage (V) |
24 |
| Maximum Supply Current (mA) |
4 |
| Minimum Operating Temperature (°C) |
-40 |
| Maximum Operating Temperature (°C) |
105 |
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PACKAGE INFO
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| Supplier Package |
TSOT-23 |
| Basic Package Type |
Lead-Frame SMT |
| Pin Count |
6 |
| Lead Shape |
Gull-wing |
| PCB |
6 |
| Tab |
N/R |
| Package Length (mm) |
2.95 |
| Package Width (mm) |
1.5 |
| Package Height (mm) |
0.85 |
| Package Diameter (mm) |
N/R |
| Mounting |
Surface Mount |
| Package Material |
Plastic |
| Package Description |
Thin Small Outline Transistor |
| Package Family Name |
SOT |
| Jedec |
N/A |
| Package Outline |
Link to Datasheet |
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MANUFACTURING INFO
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| MSL |
1 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
30 |
| Number of Reflow Cycle |
3 |
| Standard |
N/A |
| Reflow Temp. Source |
Link to Datasheet |
| Maximum Wave Temperature (°C) |
260 |
| Wave Solder Time (Sec) |
10 |
| Wave Temp. Source |
Link to Datasheet |
| Lead Finish(Plating) |
Matte Sn annealed |
| Under Plating Material |
N/A |
| Terminal Base Material |
CuFePZnAg |
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PACKAGING INFO
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| Packaging |
Tape and Reel |
| Quantity Of Packaging |
3000 |
| Packaging Document |
Link to Datasheet |
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