|
|
• Adjustable Turnon and Turnoff Slew Rate Control Through External R1, R2, and C1
|
| • Supports a Wide Range of 1.2-V to 8-V Supply Inputs |
| • Integrated NMOS for PFET Control |
• NMOSON/OFFSupports a Wide Range of 1-V to 8-V Control Logic Interface
|
• Full ESD Protection (All Pins)– HBM2kV,C
|
|
| CATALOG |
TPS27081ADDCR COUNTRY OF ORIGIN
|
TPS27081ADDCR PARAMETRIC INFO
|
TPS27081ADDCR PACKAGE INFO
|
TPS27081ADDCR MANUFACTURING INFO
|
TPS27081ADDCR PACKAGING INFO
|
TPS27081ADDCR ECAD MODELS
|
TPS27081ADDCR APPLICATIONS
|
|
COUNTRY OF ORIGIN
|
| United States of America |
| Philippines |
| China |
|
PARAMETRIC INFO
|
| Enable Logic |
Active High |
| Type |
High Side |
| Maximum Output Current (A) |
3 |
| Number of Outputs |
1 |
| Maximum Input Voltage (V) |
8 |
| Fault Protection |
ESD Protection |
| Number of Inputs |
1 |
| Minimum Operating Temperature (°C) |
-40 |
| Output Type |
P-Channel |
| Minimum Input Voltage (V) |
1 |
| Maximum Operating Temperature (°C) |
85 |
| Number of Switches |
1 |
| Typical Switch On Resistance (mOhm) |
6250 |
| Interface Type |
On/Off |
| Output Voltage Range (V) |
-0.1 to 8 |
| Maximum Power Dissipation (mW) |
1190 |
| Operating Supply Voltage Range (VDC) |
1.2 to 8 |
| Minimum Storage Temperature (°C) |
-65 |
| Maximum Storage Temperature (°C) |
150 |
|
|
PACKAGE INFO
|
| Supplier Package |
TSOT-23 |
| Basic Package Type |
Lead-Frame SMT |
| Pin Count |
6 |
| Lead Shape |
Gull-wing |
| PCB |
6 |
| Tab |
N/R |
| Pin Pitch (mm) |
0.95 |
| Package Length (mm) |
2.9 |
| Package Width (mm) |
1.6 |
| Package Height (mm) |
0.85 |
| Package Diameter (mm) |
N/R |
| Package Overall Length (mm) |
2.9 |
| Package Overall Width (mm) |
2.8 |
| Package Overall Height (mm) |
0.9 |
| Seated Plane Height (mm) |
0.9 |
| Mounting |
Surface Mount |
| Terminal Width (mm) |
0.4 |
| Package Weight (g) |
N/A |
| Package Material |
Plastic |
| Package Description |
Thin Small Outline Transistor |
| Package Family Name |
SOT |
| Jedec |
MO-193 |
| Package Outline |
Link to Datasheet |
| Maximum PACKAGE_DIMENSION_H (mm) |
1 |
| Minimum PACKAGE_DIMENSION_H (mm) |
0.7 |
| Maximum PACKAGE_DIMENSION_L (mm) |
3.05 |
| Minimum PACKAGE_DIMENSION_L (mm) |
2.75 |
| Maximum PACKAGE_DIMENSION_W (mm) |
1.75 |
| Minimum PACKAGE_DIMENSION_W (mm) |
1.45 |
| Maximum Diameter (mm) |
N/R |
| Minimum Diameter (mm) |
N/R |
| Maximum Seated_Plane_Height (mm) |
1.1 |
| Minimum Seated_Plane_Height (mm) |
0.7 |
| Ball Array Length (mm) |
N/R |
| Ball Array Width (mm) |
N/R |
| Stand-off Height (mm) |
0.05 |
| Number of Column Balls |
N/R |
| Number of Row Balls |
N/R |
| Terminal Length (mm) |
0.45 |
| Terminal Thickness (mm) |
0.16 |
| Bottom Pad Length (mm) |
N/R |
| Bottom Pad Width (mm) |
N/R |
| Bottom Pad Chamfer |
N/R |
|
|
MANUFACTURING INFO
|
| MSL |
1 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
30 |
| Number of Reflow Cycle |
3 |
| Standard |
J-STD-020D |
| Reflow Temp. Source |
Link to Datasheet |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Wave Temp. Source |
Link to Datasheet |
| Lead Finish(Plating) |
Matte Sn |
| Under Plating Material |
N/A |
| Terminal Base Material |
Cu Alloy |
| Shelf Life Period |
N/A |
| Number of Wave Cycles |
N/R |
|
|
PACKAGING INFO
|
| Packaging Suffix |
R |
| Packaging |
Tape and Reel |
| Quantity Of Packaging |
3000 |
| Reel Diameter (in) |
7.09 |
| Reel Width (mm) |
8.4 |
| Tape Pitch (mm) |
4 |
| Tape Width (mm) |
8 |
| Component Orientation |
Q3 |
| Packaging Document |
Link to Datasheet |
|
|
ECAD MODELS
|
|
|
| APPLICATIONS |
• High-Side Load Switches
|
• Inrush Current Control
|
| • Power Sequencing and Control |
| • Standby Power Isolation |
| • Portable Power Switches |
|
One-stop supplier of IC products