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• 8-bit serial-in, parallel-out shift |
• Wide operating voltage range of 2 V to 6 V |
• High-current 3-state outputs can drive up to 15
LSTTL loads |
• Low power consumption: 80-μA (maximum) ICC |
• tpd = 13 ns (typical)
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• ±6-mA output drive at 5 V |
• Low input current: 1 μA (maximum)
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• Shift register has direct clear |
• On products compliant to MIL-PRF-38535,
all parameters are tested unless otherwise noted.
On all other products, production processing does
not necessarily include testing of all parameters.
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CATALOG |
SN74HC595DR COUNTRY OF ORIGIN |
SN74HC595DR PARAMETRIC INFO |
SN74HC595DR PACKAGE INFO |
SN74HC595DR MANUFACTURING INFO |
SN74HC595DR PACKAGING INFO |
SN74HC595DR ECAD MODELS |
SN74HC595DR FUNCTIONAL BLOCK DIAGRAM
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SN74HC595DR APPLICATIONS |
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COUNTRY OF ORIGIN |
Taiwan (Province of China) |
Malaysia |
Mexico |
China |
Philippines |
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PARAMETRIC INFO |
Logic Function |
Shift Register |
Logic Family |
HC |
Process Technology |
CMOS |
Number of Count Input Enables |
0 |
Number of Element Inputs |
1 |
Number of Element Outputs |
9 |
Number of Elements per Chip |
1 |
Number of Selection Inputs per Element |
0 |
Number of Stages |
8 |
Operation Mode |
Serial to Serial/Parallel |
Output Type |
3-State |
Reset Type |
Asynchronous |
Direction Type |
Uni-Directional |
Terminal Count Output |
No |
Triggering Type |
Positive-Edge |
Minimum Operating Supply Voltage (V) |
2 |
Maximum Operating Supply Voltage (V) |
6 |
Typical Operating Supply Voltage (V) |
5 |
Minimum Operating Temperature (°C) |
-40 |
Maximum Operating Temperature (°C) |
85 |
Maximum Propagation Delay Time @ Maximum CL (ns) |
200@2V|40@4.5V|34@6V |
Absolute Propagation Delay Time (ns) |
250 |
Propagation Delay Test Condition (pF) |
150 |
Maximum Quiescent Current (mA) |
0.008 |
Minimum Storage Temperature (°C) |
-65 |
Maximum Storage Temperature (°C) |
150 |
Parallel Enable Input |
No |
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PACKAGE INFO
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Supplier Package |
SOIC |
Basic Package Type |
Lead-Frame SMT |
Pin Count |
16 |
Lead Shape |
Gull-wing |
PCB |
16 |
Tab |
N/R |
Pin Pitch (mm) |
1.27 |
Package Length (mm) |
10(Max) |
Package Width (mm) |
4(Max) |
Package Height (mm) |
1.5(Max) |
Package Diameter (mm) |
N/R |
Package Overall Length (mm) |
10(Max) |
Package Overall Width (mm) |
6.2(Max) |
Package Overall Height (mm) |
1.75(Max) |
Seated Plane Height (mm) |
1.75(Max) |
Mounting |
Surface Mount |
Package Weight (g) |
N/A |
Package Material |
Plastic |
Package Description |
Small Outline IC |
Package Family Name |
SO |
Jedec |
MS-012AC |
Package Outline |
Link to Datasheet |
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MANUFACTURING INFO |
MSL |
1 |
Maximum Reflow Temperature (°C) |
260 |
Reflow Solder Time (Sec) |
30 |
Number of Reflow Cycle |
3 |
Standard |
J-STD-020D |
Reflow Temp. Source |
Link to Datasheet |
Maximum Wave Temperature (°C) |
N/R |
Wave Solder Time (Sec) |
N/R |
Lead Finish(Plating) |
Matte Sn|Au |
Under Plating Material |
N/A|Pd over Ni |
Terminal Base Material |
N/A|Cu Alloy |
Number of Wave Cycles |
N/R |
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PACKAGING INFO |
Packaging Suffix |
R |
Packaging |
Tape and Reel |
Quantity Of Packaging |
2500 |
Reel Diameter (in) |
13 |
Reel Width (mm) |
16.4|16.8 |
Tape Pitch (mm) |
8 |
Tape Width (mm) |
16 |
Component Orientation |
Q1 |
Packaging Document |
Link to Datasheet |
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ECAD MODELS |
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FUNCTIONAL BLOCK DIAGRAM |
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APPLICATIONS |
• Network switches |
• Power infrastructure |
• LED displays |
• Servers |
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